深圳市弘晨科技有限公司

铜箔胶带

产品名称:

铜箔胶带

产品详细

EMI/RFI屏蔽用自粘性铜箔胶带 Copper foil

1. Product Data(产品数据)

1 .材質說明 (Materia1 Data)

項目(Item)	材質(Materia1)	厚度(Thickness)	說明(Description)
基材(Base Materia1)	Cu(99.9%)	0.018±0. 005mm	C1100
		0.025±0. 005mm
		0.035±0. 008mm
		0.05±0. 01mm
膠體(Adhesive)	Acrylic Adhesive	0.035±0. 004mm	感壓性膠(Pressure Sensitive Adhesive)

2.特性(Characteristics)

項目(Item)	單位(Unit)	測試值(Value)	說明(Description)
粘著力(AdhesiveStrength	Kg/inch	≧1.2	在25℃以2Kg/inch貼合測試貼合後青'f置20分鐘,再以
with180° Peel)	Kg/inch	≧1.2	1 80°方向拉張速度300mm/min
保持力(Holding Power)	hours	>24	對 SUS304 Plate以2Kg/inch貼合測試
使用温度(HeatDurability)	(℃)	≦120
阻抗值 Conductivity (ohms)	ohms		电阻仪

2.Constructure(产品结构)

3.Remarks(备注)

a. Tota1 thickness is not included ofreleasing paper(总厚度以不包含离型纸为标准)

b. This document is only as a shielding conductive materia1 parameters,(本表为屏蔽导电材料的选购指南,)

c. Test method and numerica1 according to customer requirementsfrom the ASTM D1000(测试方式.与数值依客户所要求的 ASTM D1000所得出.)

d. The data is subject to change without notice.(上述数据变更, 恕不另行通知. )

e. Some refer to the plastic insulation resistance, instead ofthe entire product, the numerica1 result of copper,,aluminum or various other changes in the substrate

(绝缘电阻单指胶的部分,而ll1整个1⊠品,该数信会因铜,铝或其它基材不同有所改变.)

4.Shielding effectiveness The testing conditions for the temperature of20 ° C and relative humidity under65 ° C