Thermal conductive potting silicone sealant RTV-2
Features Applications
.Thermal conductivity: 1.0W/M-K . Power transistor module
. Two components: A & B . LED driving power
. Auto deaeration . Integrated chipset
. Good high & low temperature resistance . LED encapsulation
. Good physical and chemical stability . Power module
. REACH, RoHS and UL compliant . Telecom devices
. Others
Method of Use (As above picture shows):
. Compound A and B per weight rate
. Fill and seal after completely compounding.
Physical Properties:
PROPERTY |
PC100-01 |
PC100-02 |
PC200-01 |
PC200-02 |
TEST METHOD |
Color |
A: Gray B:Lucency |
B:Lucency |
A: White B: White |
A: White B: White |
Visual |
Mix Ratio by Weight |
10:1 |
10:1 |
1:1 |
1:1 |
---- |
Hardness |
60°C Shore C |
75°C Shore C |
75°C Shore C |
ASTM D2240 |
|
Adhesiveness |
5000cps |
5000cps |
5000cps |
ASTM D412 |
|
Pot Life (Hour, 25°C) |
1H |
5H |
0.5H |
1H |
---- |
Room Curing Time |
2H |
24H |
1H |
2H |
---- |
Cured Density |
1.7 |
1.7 |
1.7 |
1.7 |
ASTM D792 |
Thermal conductivity |
1.0 W/M-K |
1.0 W/M-K |
1.0 W/M-K |
1.0 W/M-K |
ASTM D5470 |
Shelf Life |
12 months under 25°C with sealed container. |