1. Product Data(产品数据)
1 .材質說明 (Materia1 Data)
項目(Item) |
材質(Materia1) |
厚度(Thickness) |
說明(Description) |
基材(Base Materia1) |
Cu(99.9%) |
0.018±0. 005mm |
C1100 |
0.025±0. 005mm |
|||
0.035±0. 008mm |
|||
0.05±0. 01mm |
|||
膠體(Adhesive) |
Acrylic Adhesive |
0.035±0. 004mm |
感壓性膠(Pressure Sensitive Adhesive)
|
2.特性(Characteristics)
項目(Item) |
單位(Unit) |
測試值(Value) |
說明(Description) |
粘著力(AdhesiveStrength |
Kg/inch |
≧1.2 |
在25℃以2Kg/inch貼合測試貼合後青'f置20分鐘,再以 |
with180° Peel) |
1 80°方向拉張速度300mm/min |
||
保持力(Holding Power) |
hours |
>24 |
對 SUS304 Plate以2Kg/inch貼合測試 |
使用温度(HeatDurability) |
(℃) |
≦120 |
|
阻抗值 Conductivity (ohms) |
ohms |
|
电阻仪 |
2.Constructure(产品结构)
3.Remarks(备注)
a. Tota1 thickness is not included ofreleasing paper(总厚度以不包含离型纸为标准)
b. This document is only as a shielding conductive materia1 parameters,(本表为屏蔽导电材料的选购指南,)
c. Test method and numerica1 according to customer requirementsfrom the ASTM D1000(测试方式.与数值依客户所要求的 ASTM D1000所得出.)
d. The data is subject to change without notice.(上述数据变更, 恕不另行通知. )
e. Some refer to the plastic insulation resistance, instead ofthe entire product, the numerica1 result of copper,,aluminum or various other changes in the substrate
(绝缘电阻单指胶的部分,而ll1整个1⊠品,该数信会因铜,铝或其它基材不同有所改变.)
4.Shielding effectiveness The testing conditions for the temperature of20 ° C and relative humidity under65 ° C