Features Applications
﹒Thermal conductivity:1.0/2.0/3.0 Power Modules
﹒No settlement, stored at room temperature Integrated chip
﹒Excellent resistance to high and low Car electronic products
temperature , excellent resistance to weather Controller
﹒Radiation resistance and excellent dielectric properties Telecommunications Equipment
﹒Excellent chemical and stability mechanical
﹒Low stress, low modulus thermal products
﹒Has plasticity like plasticine , easy to operate
﹒Suitable for the product design which require big
variation in the thickness
Property |
HCN-100 |
HCN-200 |
HCN-300 |
TEST METHOD |
UNIT |
|
Density |
1.0 |
2.0 |
3.0 |
ASTM D792 |
--- |
|
Color |
White |
Gray |
Gray |
--- |
Visual |
|
Thermal conductivity |
1.0 |
2.0 |
3.0 |
ASTM D5470 |
W/mK |
|
Thermal Resistance |
0.004 |
0.003 |
0.001 |
ASTM D5470 |
C-In2/W |
|
Breakdown Voltage |
1100 |
1000 |
1000 |
ASTM D149 |
VAC/mil |
|
Dielectric Constant |
4.5 |
4.7 |
4.8 |
ASTM D150 |
--- |
|
Volume Voltage |
>1013 |
>1013 |
>1012 |
ASTM D257 |
--- |
|
Work Temp |
-50℃ to 200℃ |
Store Method:
. This item can be saved for 24 months when it is sealed under room temperature 25℃